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Leverage the Eaton Boyd Thermal rack emulator to verify leak-free piping and Cooling Distribution Unit (CDU) operation, check electrical input power wiring and delivery, and most importantly, simulate the pressure drop of the server rack to validate the CDU performance. Customers that use the rack emulator can expedite AI Data Center installations and performance validation, bringing more processing power online faster.
A rack emulator is a piece of equipment designed to test and verify the thermal and flow performance of a coolant distribution unit prior to IT equipment installation. A rack emulator sits in the same footprint as a rack and mimics the thermal and flow load output of a real rack.
A rack emulator mimics the thermal load and pressure drop of a rack of IT equipment. A series of high-powered heaters generate heat equivalent to the amount created by AI processors, memory and other electronics that would be connected to the Technology Cooling System (TCS) liquid cooling loop. A control valve adjusts to match the pressure drop the TCS loop would experience across the entire liquid system within the rack, from the liquid cooling loop, through quick disconnects, and out through the manifolds. In addition, commissioning personnel can test and validate input power with the rack emulator prior to AI rack installation.
Eaton's Boyd Thermal rack emulator fully simulates AI server rack function and footprint, as opposed to traditional load banks that only force heat through a system. Our rack emulator is a dynamic load that can imitate a server rack during operation. This enables commissioning professionals to ensure complex liquid cooling systems are correctly setup to meet performance requirements.
Tube fin heat exchangers
Liquid cooled chassis and enclosures
Rack emulator
Chillers
Pumped two-phase cooling systems
Thermal control unit
Plate-fin heat exchanger
Liquid cooling loops
Liquid cold plates
Coolant distribution unit (CDU)
Heat pipe assemblies
Immersion cooling
Thermosiphons
Air to air heat exchangers
Air-cooled chassis and enclosures
Heat sinks
Heat spreaders and conductive chassis
Thermal straps and busses
3D vapor chamber assemblies
Ultra-thin vapor chambers
Coolant distribution unit service
Logic sockets
Axial fans
Heat sink assemblies
Memory burn-in sockets
Aluminum extrusion profiles
Metal fabrication
Clean room manufacturing
Prototyping and sampling
Testing and validating
Features |
Metric |
Imperial |
| Dimensions | 610mm x 1513mm x 2400mm | 24” x 60” x 94.5” |
| Weight (dry) | 770 kg | 1700 lbs |
| Electrical service | 380-480 VAC / 3 Ph / 50 and 60 Hz | |
| Thermal load | Up to 250 kW at 480 VAC | |
| Minimum flow rate | 70 LPM | 18.5 GPM |
| Maximum flow rate | 420 LPM | 110 GPM |
| Minimum pressure drop | 0.4 bar | 6 PSI |
| Maximum pressure drop | 2.75 bar | 40 PSI |